Silicon Labs Series 3: Purpose-Built for the IoT
Silicon Labs Series 3 devices represent the next generation of IoT wireless product development. This is the first embedded computing platform with the security, performance, power efficiency, and low cost required to tap into emerging IoT market opportunities. Our Series 3 22nm wireless platform will be the only multi-radio solution architected with a common code base and memory options for future proofing and backwards compatibility with Series 2. This flexibility and features make this the most scalable wireless platform available and will result in more efficient development and application portability.
Series 3 Wireless Platform Features
Extensible
Extend your design flexibility across wireless platforms, protocols, and applications while scaling for new and expanding use cases. High performance and low power creates high-volume opportunities for connected devices.
High-Performance
More than 100x the processing capability, including an integrated AI/ ML accelerator for edge devices enabling consolidation of system processing into wireless SoC. Eliminate MCUs that take up space and add cost to your system.
スケーラブル
The only multi-radio platform architected with a common code base across 30+ Silicon Labs devices. Flexible manufacturing mitigates supply risks and includes memory options that future proof designs.
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